ASRock Rack Announces latest HPC Motherboard Solutions Compatible with 3rd Gen Intel® Xeon® Scalable Processors for Workload Optimized
Taipei, Taiwan – April 6th, 2021 – ASRock Rack Inc., specializing in the field of high performance cloud computing server hardware, has optimized it's HPC solutions roadmap to fully support the newly announced industry leading performance 3rd Gen Intel® Xeon® Scalable processors. The latest 3rd Gen Intel® Xeon® Scalable processors deliver breakthrough performance for a wide range of diverse and challenging HPC and AI applications in fields like manufacturing, finance, life sciences, geosciences, crypto acceleration and more. The innovations from Intel® in core architecture and security, plus improved memory bandwidth and higher core counts, help users address complex requirements and unleash the value of data for better efficiency.
Thus, ASRock Rack reveals seven motherboard solutions for the latest 3rd Gen Intel® Xeon® Scalable processors. The SPC621D8-2L2T is the normal ATX solution that goes with four PCIe4.0 x16 and three PCIe4.0 x 8 and dual 10 GbE and dual 1GbE with one more IPMI networking solutions.
Furthermore, the SPC621D8HM3 and SP2C621D16H-2T2O are the Half-width form factor solutions while SPC621D8HM3 is single socket and SP2C621D16H-2T2O is dual socket solution. Moreover, there are SPC621D16QM32 and SP2C621D16N in EEB form factor and SP2C621D32LM3 in L-shape and SP2C621D32GM-2T in Proprietary. Here is the detail specification chart for these seven motherboards.
| Model | SPC621D8HM3 | SPC621D8-2L2T | SPC621D16QM32 | SP2C621D16N | SP2C621D16H-2T2O | SP2C621D32LM3 | SP2C621D32GM-2T |
| Form Factor | Half-width (6.6" x 17") | ATX (12" x 9.6") | EEB (12" x 13") | EEB (12.2" x 13.12") | Half-width (6.5" x 20") | L-shape (18.86" x 17.01") | Proprietary (16.53" x 13.79") |
| Socket | Single Socket P+ | Single Socket P+ | Single Socket P+ | Dual Socket P+ | Dual Socket P+ | Dual Socket P+ | Dual Socket P+ |
| DIMM Slot | 8 DIMMs, 1DPC | 8 DIMMs, 1DPC | 16 DIMMs, 2DPC | 8+8 DIMMs, 1DPC | 8+8 DIMMs, 1DPC | 16+16 DIMMs, 2DPC | 16+16 DIMMs, 2DPC |
| PCIe | 2x PCIe4.0 x16 | 4x PCIe4.0 x16, 3x PCIe4.0 x8 | 2x PCIe4.0 x16 | 3x PCIe4.0 x16, 3x PCIe4.0 x8 | 1x PCIe4.0 x24, 1x PCIe4.0 x16 | 2x PCIe4.0 x24, 1x PCIe4.0 x16 | None |
| M.2 | 1x M-Key 22110, 1x M-Key 2280 | 2x M-Key 22110 | 2x M-Key 22110 | 2x M-Key 2280 | 1x M-Key 2280 | 1x M-Key 2280 | 2x M-Key 22110 |
| LAN | 1 Dedicated IPMI | 2x 10GbE (RJ45), 2x 1GbE, 1 Dedicated IPMI | 2x 1GbE, 1 Dedicated IPMI | 2x 1GbE, 1 Dedicated IPMI | 2x 10GbE (SFP+), 2x 10GbE (RJ45), 1 Dedicated IPMI | 1 Dedicated IPMI | 2x 10GbE (RJ45), 1 Dedicated IPMI |
| SATA | Up to 11x SATA 6Gb/s | Up to 9x SATA 6Gb/s | Up to 14x SATA 6Gb/s | Up to 8x SATA 6Gb/s | Up to 3x SATA 6Gb/s | Up to 14x SATA 6Gb/s | Up to 10x SATA 6Gb/s |
| I/O | 4x USB3.2 Gen1, 3x USB2.0, 1x COM Port Header | 2x USB3.2 Gen2, 6x USB3.2 Gen1, 3x USB 2.0, 1x COM Port Header | 5x USB3.2 Gen1, 2x USB2.0, 1x COM Port | 4x USB3.2 Gen1, 1x COM Port Header | 2x USB3.2 Gen1, 1x USB2.0, 1x Audio COM Port | 5x USB3.2 Gen1, 2x USB 2.0, 1x COM Port | 6x USB3.2 Gen1, 2x USB2.0, 1x COM Port Header |
| Security | Supports 17-pin (LPC) or 13-pin (SPI) TPM modules | Supports 17-pin (LPC) or 13-pin (SPI) TPM modules | Supports 13-pin (SPI) TPM modules And BTO PFR | Support 13-pin (SPI) TPM module | Supports 17-pin (LPC) or 13-pin (SPI) TPM modules And BTO PFR | Supports 13-pin (SPI) TPM modules And BTO PFR | Supports 13-pin (SPI) TPM modules And BTO PFR |
For more information on the latest 3rd Gen Intel® Xeon® Scalable processors-based solutions, please visit our website at https://www.asrockrack.com/minisite/IntelIceLake/
For more purchasing information, please visit https://www.asrockrack.com/general/buy.asp to contact one of our local partners, or email us directly, ASRockRack_sales@asrockrack.com
Intel, the Intel® logo, and other Intel® marks are trademarks of Intel® Corporation or its subsidiaries.
