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ASRock Rack Highlights New Supporting Open Compute Project Solutions at OCP U.S. Summit 2018

San Jose, U.S. – OCP U.S. Summit 2018 – March 20, 2018 – As Facebook leading the way in the open compute project and industry standardization, the Open Compute Project's annual U.S. Summit 2018 is one of the premier datacenter hardware events taking place from March 20-21 at San Jose Convention Center, USA. To embrace the global open-source hardware ecosystem in the data center industry, ASRock Rack, specializing in high performance and high-efficiency server technology, showcases its latest industry leading OCP-compliant solutions in booth #B16. The OCP-ORV2 supports the Intel^® Xeon^® Scalable based 2U Rackmount system to maximize server, storage and datacenter hardware innovations and energy efficiency as well as to reduce operational complexity for scalable and cloud computing.

Optimized for demands of densest datacenter environments, the ASRock Rack OCP-ORV2 barebone system supports Intel^® Xeon^® Scalable platform design and features the highest density Dual Intel^® Xeon^® Scalable processor half-width (OCP Blade) EP2C622D24HM server motherboard with twenty-four DDR4 2666 DIMM slots that provides industry-leading memory capability in 2U form factor. The EP2C622D24HM in compliance with OCP2.0 supports thirteen SATA3 ports along with an M.2 slot for added flexibility as well as the OCP compliance mezzanine cards type A/B/C for extended functionality. Moreover, based on the design of half-width SSI Dual Intel^® Xeon^® Scalable processor, the EP2C622D16HM is the best server board choice for high performance computing node, virtualization server, 5G system data node, telecom usage 4U8N possible applications.

ASRock Rack also highlights a complete line of OCP compatible Ethernet and storage mezzanine cards featuring flexible and scalable I/O adapter solutions to boost customers' networking and storage capabilities for today's demanding virtualized and unified storage and data center environments.

Anticipating attendance of more than 3,000 key decision makers, executives, engineers, developers and suppliers at OCP U.S. SUMMIT 2018 to grow, drive and support the open hardware ecosystem in, near and around the data center and beyond, sincerely invite you to visit ASRock Rack (Booth #B16) to learn how open, flexible, scalable and efficient OCP3.0 and ORV2 compatible server system technology developments to transform the future of scale computing solutions!

Event Details

• Date: Mar. 20-21, 2018
  (March 20, 2018 11:30a-7:30p; March 21, 2018 8:00a-3:00p)
• Venue: San Jose Convention Center, CA, USA
• Booth: #B16

Main Features

OCP-ORV2

• Dual Socket P (LGA3647) Intel^® Xeon^® Scalable Processors
• Supports Six Channel DDR4 2666/2400/2133 RDIMM, LRDIMM, 24DIMM Slots
• Supports 14 SATA3 by C624 ( 3x MiniSAS HD from 8 SATA port and 4 Ssata, 1x M.2 from sSATA, 1 x SATA DOM from sSATA )
• Support 1* PCIe 3.0 x 24, 1* PCIE 3.0 x 8

EP2C622D24HM

• Half Width (OCP Blade) 6.5" x20"
• Supports Intel^® Xeon Scalable Processors
• Supports six Channel DDR4 2666/2400/2133 RDIMM/LR DIMM
• Intel^® C622：13x SATA3 (by 3x MiniSAS HD, 1 sSATA (share with M.2) )
• Supports 1 x PCIe 3.0 x24, 1 x PCIe 3.0 x8
• 1 x USB 3.0 ports

EP2C622D16HM

• Half 20''x 6.5'
• Dual Socket P support Intel^® Xeon processor E5-2600 v5 series
• Supports six Channel DDR4 2666/2400/2133 RDIMM/LR DIMM
• Supports 14 x SATA3 6.0 Gb/s by INTEL C622(including 1x SATA DOM ports and 1x M.2 ports)
• Supports 2 PCIe3.0x 16